Triple channel memory kits intel-based X58 motherboards blister clamshell box esd package conductive antistatic

Model Photo Spec Dimension (closed) Size of back card Material g / 1pc CTN Size
triple-channel dram module pack (7)

Intel XMP (Extreme Memory Profile)Core i7 x58

* For 3 dram module long dimm (ddr3, ddr2, ddr1 and sdr)

* For 3 long dimm + heatsinks

 

esd package electro-static dissipating antistatic conductive clamshell box ddr3 ddr2 ddr1 sdr long dimm so dimm micro dimm mini dimm

 165 x 113 x mm      

 

 

 

Model Photo Spec Dimension (closed) Size of back card Material g / 1pc CTN Size
1933-001 (lid) + 1933-002 (base) / triple-channel dram module pack (6) In

Intel XMP (Extreme Memory Profile)Core i7 x58

* For 3 dram module long dimm (ddr3, ddr2, ddr1 and sdr)

* For 3 long dimm + heatsinks

 

esd package electro-static dissipating antistatic conductive clamshell box ddr3 ddr2 ddr1 sdr long dimm so dimm micro dimm mini dimm

 169 x 132x 13mm      

 

 

 

 

Model Photo Spec Dimension (closed) Size of back card Material g / 1pc CTN Size
1933-001 (lid) + 1933-003 (base) / triple-channel dram module pack (5) InIntel XMP (Extreme Memory Profile)Core i7 x58

* For 3 dram module long dimm (ddr3, ddr2, ddr1 and sdr)

* For 3 long dimm + heatsinks

* For 3 dram module so dimm (ddr3, ddr2, ddr1 and sdr)

* For 3 so dimm + heatsinks

esd package electro-static dissipating antistatic conductive clamshell box ddr3 ddr2 ddr1 sdr long dimm so dimm micro dimm mini dimm

 169 x 132x 13mm      

 

 

 

 

Model Photo Spec Dimension (closed) Size of back card Material g / 1pc CTN Size
1917 / triple-channel dram module pack (1) Intel XMP (Extreme Memory Profile)Core i7 x58

* For 3 dram module long dimm (ddr3, ddr2, ddr1 and sdr)

* For 3 long dimm + heatsinks

esd package electro-static dissipating antistatic conductive clamshell box ddr3 ddr2 ddr1 sdr long dimm so dimm micro dimm mini dimm

 202 x 165 x 15mm 168 x 148mm     

 

 

 

 

Model Photo Spec Dimension (closed) Size of back card Material g / 1pc CTN Size
1917-1 / triple-channel dram module pack (2) Intel XMP (Extreme Memory Profile)Core i7 x58

* For 3 dram module long dimm (ddr3, ddr2, ddr1 and sdr)

* For 3 long dimm + heatsinks

esd package electro-static dissipating antistatic conductive clamshell box ddr3 ddr2 ddr1 sdr long dimm so dimm micro dimm mini dimm

 202 x 165 x 15mm  168 x 148mm     

 

 

 

 

Model Photo Spec Dimension (closed) Size of back card Material g / 1pc CTN Size
1931-triple channel dram module pack (4) Intel XMP (Extreme Memory Profile)Core i7 x58

* For 3 dram module long dimm (ddr3, ddr2, ddr1 and sdr)

* For 3 long dimm + heatsinks

 264x 160 x 15mm 144 x 230mm      

 

Model Photo Spec Dimension (closed) Size of back card Material g / 1pc CTN Size
1890-triple channel dram module pack (3) Intel XMP (Extreme Memory Profile)Core i7 x58

* For 3 dram module long dimm (ddr3, ddr2, ddr1 and sdr)

* For 3 long dimm + heatsinks

 155 x 160 x 18mm 149 x 126mm      

Kingston is now launching new HyperX DDR3 triple-channel kits designed specifically for the new Intel-based X58 motherboards.
"Kingston is excited to bring the fastest DDR3 triple channel memory products to market as we are the first to deliver 2000MHz gaming kits of three with Intel's reduced voltage," said Mark Tekunoff, senior technology manager, Kingston. "All of our triple-channel kits can be overclocked manually or by using XMP-ready profiles. The 2GHz modules have been tested to support up to that speed on ASUS P6T Deluxe motherboards while the Intel DX58SO motherboards have been tested up to 1600MHz."
In addition to the top-of-the-line 2000MHz modules, Kingston's family of triple-channel kits include 1866MHz, 1800MHz, and low-latency 1600MHz and 1375MHz speeds. Kingston ValueRAM kits of three are also available in 1333MHz and 1066MHz speeds: